Patent Assignment
Reel/Frame 035647/0697
Assignment of Assignor's Interest
Recorded: 2015-05-15
Pages: 4
Assignors
CHIANG, CHING-WEN
Executed: 2014-06-26
CHEN, KUANG-HSIN
Executed: 2014-06-26
CHEN, HSIEN-WEN
Executed: 2014-06-26
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Package Structure and Fabrication Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.