Patent Assignment
Reel/Frame 035671/0365
Assignment of Assignor's Interest
Recorded: 2015-05-19
Pages: 3
Assignor
OGAWA, TAKASHI
Executed: 2015-03-24
Assignee
TOYOTA JIDOSHA KABUSHIKI KAISHA
1, TOYOTA-CHO, TOYOTA-SHI, AICHI-KEN, 471-8571, JAPAN
Covered Property
(1)
Multilayer Wiring Board and Manufacturing Method for the Multilayer Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.