IP Library Assignment 035714/0209
Patent Assignment
Reel/Frame 035714/0209

Assignment of Assignor's Interest

Recorded: 2015-05-26 Pages: 3
Assignors
HOLEC, HENRY V.
Executed: 2009-03-18
CRANDELL, WM. TODD
Executed: 2009-03-18
Assignee
METROSPEC TECHNOLOGY, LLC
2401 PILOT KNOB ROAD, #108, MENDOTA HEIGHTS, MINNESOTA, 55120
Covered Property (1)
Circuit Board Having a Plated Through Hole Through a Conductive Pad
Patent: 9,357,639 →
Application: 14/633,726 →
Publication: US 2015/0173183