Patent Assignment
Reel/Frame 035720/0559
Assignment of Assignor's Interest
Recorded: 2015-05-27
Pages: 2
Assignors
CHEN, HSIEN-WEI
Executed: 2015-04-28
SU, AN-JHIH
Executed: 2015-04-27
WANG, JO-MEI
Executed: 2015-04-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Devices, Packaging Devices, and Methods of Packaging Semiconductor Devices