Patent Assignment
Reel/Frame 035723/0183
Assignment of Assignor's Interest
Recorded: 2015-05-27
Pages: 5
Assignee
RF MICRO DEVICES, INC.
7628 THORNDIKE ROAD, GREENSBORO, NORTH CAROLINA, 27409
Covered Property
(1)
Using an Interconnect Bump to Traverse Through a Passivation Layer of a Semiconductor Die
Application:
13/948,516 →
Publication:
US 2014/0021603
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.