IP Library Assignment 035724/0739
Patent Assignment
Reel/Frame 035724/0739

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2015-05-27 Received: 2015-05-27 Pages: 4
Assignors
GONG, ZHIWEI
Executed: 2015-05-26
VINCENT, MICHAEL B.
Executed: 2015-05-26
Assignee
FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON DRIVE WEST, LAW DEPARTMENT, AUSTIN, TX, 78735, UNITED STATES
Covered Application (1)
PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FOR PACKAGE INTERCONNECTION
App. No. 14/723,007