Patent Assignment
Reel/Frame 035726/0870
Assignment of Assignor's Interest
Recorded: 2015-05-27
Pages: 5
Assignors
HUANG, SHAO-HUA
Executed: 2015-03-24
WU, CHIH-LING
Executed: 2015-03-24
LO, YU-YUN
Executed: 2015-03-24
LIN, TZU-YANG
Executed: 2015-03-24
LAI, YU-HUNG
Executed: 2015-03-24
Assignee
PLAYNITRIDE INC.
7F., NO.615, SEC. 2, DATONG RD., EAST DIST.,, TAINAN CITY, 701, TAIWAN
Covered Property
(1)
Flip Chip Package Structure and Wafer Level Package Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.