Patent Assignment
Reel/Frame 035792/0174
Assignment of Assignor's Interest
Recorded: 2015-06-05
Pages: 4
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property
(1)
High Performance Thermoset Useful for Electrical Laminate, High Density Interconnect and Interconnect Substrate Applications
Application:
13/990,841 →
Publication:
US 2013/0303659
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.