Patent Assignment
Reel/Frame 035867/0322
Assignment of Assignor's Interest
Recorded: 2015-06-09
Pages: 7
Assignee
NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
D1, CHINA NETWORK INT'L INNOVATION PARK, 200 LINGHU BOULEVARD, WUXI, JIANGSU, 214135, CHINA
Covered Property
(1)
Heat Dissipation Solution for Advanced Chip Packages