Patent Assignment
Reel/Frame 035917/0836
Assignment of Assignor's Interest
Recorded: 2015-06-26
Pages: 4
Assignors
LIU, JERRY
Executed: 2015-06-23
WU, PHIL
Executed: 2015-06-24
HUANG, HERB HE
Executed: 2015-06-23
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANG JIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
vertically integrated three-dimensional cmos image sensors (3d cis) bonded with control circuit substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.