Patent Assignment
Reel/Frame 035918/0429
Assignment of Assignor's Interest
Recorded: 2015-06-16
Pages: 8
Assignors
LIM, SUNG KYU
Executed: 2015-02-04
CHATHA, KARAMVIR SINGH
Executed: 2015-06-04
DU, YANG
Executed: 2015-03-09
SAMADI, KAMBIZ
Executed: 2015-01-30
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Memory Controller Placement in a Three-Dimensional (3D) Integrated Circuit (Ic) (3DIC) Employing Distributed Through-Silicon-via (Tsv) Farms