Patent Assignment
Reel/Frame 035951/0411
Assignment of Assignor's Interest
Recorded: 2015-06-23
Pages: 7
Assignors
PARK, SANG-JINE
Executed: 2015-02-13
YOON, BO-UN
Executed: 2015-02-13
JEON, HA-YOUNG
Executed: 2015-02-13
GIL, YEON-JIN
Executed: 2015-02-13
YUN, JI-WON
Executed: 2015-02-13
CHOI, WON-SANG
Executed: 2015-02-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including an Isolation Layer on a Fin and Methods of Forming Semiconductor Devices Including an Isolation Layer on a Fin