Patent Assignment
Reel/Frame 036060/0085
Assignment of Assignor's Interest
Recorded: 2015-07-10
Pages: 7
Assignors
CHUN, JIN-HO
Executed: 2015-07-06
KANG, PIL-KYU
Executed: 2015-07-06
PARK, BYUNG-LYUL
Executed: 2015-07-06
PARK, JAE-HWA
Executed: 2015-07-06
CHOI, JU-IL
Executed: 2015-07-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer-To-Wafer Bonding Structure