Patent Assignment
Reel/Frame 036072/0177
Assignment of Assignor's Interest
Recorded: 2015-07-13
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2015-06-12
LIU, CHUNG-SHI
Executed: 2015-06-12
LIN, CHIH-WEI
Executed: 2015-06-12
KUO, HUNG-JUI
Executed: 2015-06-12
CHENG, MING-DA
Executed: 2015-06-12
HU, YU-HSIANG
Executed: 2015-06-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Packages Having Through Package Vias