Patent Assignment
Reel/Frame 036101/0110
Change of Name
Recorded: 2015-07-13
Pages: 2
Assignor
KONINKLIJKE PHILIPS ELECTRONICS N.V.
Executed: 2013-05-15
Assignee
KONINKLIJKE PHILIPS N.V.
HIGH TECH CAMPUS 5, EINDHOVEN, 5656 AE, NETHERLANDS
Covered Property
(1)
Moulded Lens Forming a Chip Scale Led Package and Method of Manufacturing the Same
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 25, 2014
From: BIERHUIZEN, SERGE JOEL ARMAND
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 033417/0869 →
Security Interest
Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
Assignment of Assignor's Interest
Nov 9, 2017
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 044416/0019 →
Security Interest
Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
Release of Security Interest
Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
Assignment of Assignor's Interest
Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →