Patent Assignment
Reel/Frame 036129/0653
Change of Name
Recorded: 2015-07-17
Pages: 2
Assignor
KONINKLIJKE PHILIPS ELECTRONICS N.V.
Executed: 2013-05-15
Assignee
KONINKLIJKE PHILIPS N.V.
HIGH TECH CAMPUS 5, EINDHOVEN, 5656 AE, NETHERLANDS
Covered Property
(1)
Method of Bonding a Substrate to a Semiconductor Light Emitting Device
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 9, 2014
From: BASIN, GRIGORIY; EPLER, JOHN EDWARD; MARTIN, PAUL SCOTT
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 031924/0173 →
Assignment of Assignor's Interest
Jun 15, 2017
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 042821/0001 →
Security Interest
Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
Security Interest
Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
Release of Security Interest
Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
Assignment of Assignor's Interest
Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →