Patent Assignment
Reel/Frame 036158/0823
Assignment of Assignor's Interest
Recorded: 2015-07-23
Pages: 4
Assignors
CHEN, HSIEN-WEI
Executed: 2015-05-26
SU, AN-JHIH
Executed: 2015-05-26
HUANG, LI-HSIEN
Executed: 2015-05-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Device, Package Structure and Method of Forming the Same