Patent Assignment
Reel/Frame 036185/0171
Assignment of Assignor's Interest
Recorded: 2015-07-27
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Package-On-Package Type Semiconductor Device Which Is Realized Through Applying Not a Tsv Technology but a Fan-Out Wafer Level Package Technology