Patent Assignment
Reel/Frame 036227/0943
Assignment of Assignor's Interest
Recorded: 2015-07-31
Received: 2015-07-31
Pages: 7
Assignors
CAPARAS, JOSE A.
Executed: 2015-07-31
CHOI, WON KYOUNG
Executed: 2015-07-31
GOH, SZE PING
Executed: 2015-07-31
MARIMUTHU, PANDI C.
Executed: 2015-07-31
SHIM, IL KWON
Executed: 2015-07-31
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Double-Sided Fan-Out Wafer Level Package
Application:
14/814,906 →