Patent Assignment
Reel/Frame 036296/0470
Assignment of Assignor's Interest
Recorded: 2015-08-11
Pages: 6
Assignors
STEIMLE, ROBERT F.
Executed: 2015-08-10
DANIELS, DWIGHT L.
Executed: 2015-08-07
GUNTURU, VEERA M.
Executed: 2015-08-10
Assignee
FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON DRIVE WEST, LAW DEPARTMENT, AUSTIN, TEXAS, 78735
Covered Property
(1)
Method of Bond Pad Protection During Wafer Processing
Patent:
9,443,782 →
Application:
14/823,069 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement to the Security Agreement
Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
Merger
Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040652 Frame: 0241. Assignor(S) Hereby Confirms the Merger and Change of Name.
Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
Release of Security Interest
Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →