Patent Assignment
Reel/Frame 036308/0484
Assignment of Assignor's Interest
Recorded: 2015-08-12
Pages: 5
Assignor
KWON, YONGHWAN
Executed: 2015-05-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Fabricating Fan-Out Wafer Level Package and Fan-Out Wafer Level Package Fabricated Thereby