Patent Assignment
Reel/Frame 036316/0045
Assignment of Assignor's Interest
Recorded: 2015-08-13
Pages: 12
Assignors
TSAI, YU-CHENG
Executed: 2015-07-24
CHUANG, CHUN-CHIEH
Executed: 2015-07-24
WANG, CHING-CHUN
Executed: 2015-07-31
YAUNG, DUN-NIAN
Executed: 2015-08-05
HUNG, FENG-CHI
Executed: 2015-07-24
HUANG, CHIH-HUI
Executed: 2015-07-24
LU, YAN-CHIH
Executed: 2015-07-24
CHEN, JU-SHI
Executed: 2015-07-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Hybrid Bond Using a Copper Alloy for Yield Improvement