Patent Assignment
Reel/Frame 036327/0621
PATENT PURCHASE AGREEMENT (WITH REDACTIONS)
Recorded: 2015-08-11
Received: 2015-08-11
Pages: 12
Assignor
FREESCALE SEMICONDUCTOR, INC.
Executed: 2014-09-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TWX, 300-77, TAIWAN
Covered Applications
(4)
LITHOGRAPHIC TEMPLATE AND METHOD OF FORMATION AND USE
App. No. 10/103,608
→
AMORPHOUS CARBON LAYER FOR IMPROVED ADHESION OF PHOTORESIST AND METHOD OF FABRICATION
App. No. 10/040,984
→
METHOD FOR PATTERNING RESIST
App. No. 09/817,408
→
LITHOGRAPHIC TEMPLATE AND METHOD OF FORMATION AND USE
App. No. 09/797,558
→