IP Library Assignment 036330/0166
Patent Assignment
Reel/Frame 036330/0166

Assignment of Assignor's Interest

Recorded: 2015-08-14 Pages: 10
Assignors
TAKEMURA, KOICHI
Executed: 2015-05-14
SHIBATA, TOMOFUSA
Executed: 2015-05-14
ITO, YOSHINORI
Executed: 2015-05-14
TAGUCHI, YOSHIKAGA
Executed: 2015-05-14
Assignee
OMRON CORPORATION
801, MINAMIFUDODO-CHO, HORIKAWAHIGASHIIRU, SHIOKOJI-DORI, SHIMOGYO-KU, KYOTO-SHI, KYOTO, 600-8530, JAPAN
Covered Property (1)
Mold Structure, Transfer Molding Apparatus, and Transfer Molding Method
Application: 14/704,276 →
Publication: US 2015/0343678
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 10, 2021
From: OMRON CORPORATION
To: TOHOKU DENSHI CO., LTD.
Reel/Frame 055219/0844 →