Patent Assignment
Reel/Frame 036331/0668
Assignment of Assignor's Interest
Recorded: 2015-08-14
Pages: 4
Assignee
DAICEL CORPORATION
3-4-5, UMEDA, KITA-KU, OSAKA-SHI, OSAKA, 530-0001, JAPAN
Covered Property
(1)
Curable Resin Composition and Cured Product Thereof, Encapsulant, and Semiconductor Device