Patent Assignment
Reel/Frame 036453/0723
Assignment of Assignor's Interest
Recorded: 2015-08-29
Pages: 9
Assignors
YOSHIDA, SHIN
Executed: 2014-01-08
YOSHITAKE, MAKOTO
Executed: 2014-01-08
YAMAZAKI, HARUNA
Executed: 2014-01-08
AMAKO, MASAAKI
Executed: 2014-01-08
NAKATA, TOSHIKI
Executed: 2014-01-08
Assignee
DOW CORNING TORAY CO., LTD
5-1, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Hot-Melt Type Curable Silicone Composition for Compression Molding or Laminating
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 29, 2015
From: SWIER, STEVEN
To: DOW CORNING CORPORATION
Reel/Frame 036453/0714 →
Change of Name
Mar 7, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045515/0548 →
Assignment of Assignor's Interest
May 17, 2019
From: DOW CORNING TORAY CO., LTD.
To: DOW TORAY CO., LTD.
Reel/Frame 051322/0925 →