IP Library Assignment 036462/0001
Patent Assignment
Reel/Frame 036462/0001

Assignment of Assignor's Interest

Recorded: 2015-08-31 Pages: 14
Assignors
EIBL, JOHANN
Executed: 2015-08-05
TAEGER, SEBASTIAN
Executed: 2015-08-21
HÖPPEL, LUTZ
Executed: 2015-08-04
ENGL, KARL
Executed: 2015-08-04
RAMMELSBERGER, STEFANIE
Executed: 2015-08-04
MAUTE, MARKUS
Executed: 2015-08-10
HUBER, MICHAEL
Executed: 2015-08-06
HARTMANN, RAINER
Executed: 2015-08-04
HARTUNG, GEORG
Executed: 2015-08-08
Assignee
OSRAM OPTO SEMICONDUCTORS GMBH
LEIBNIZSTRASSE 4, REGENSBURG, 93055, GERMANY
Covered Property (1)
Optoelectronic Semiconductor Chip Encapsulated with an ALD Layer and Corresponding Method for Production
Patent: 9,761,770 →
Application: 14/760,454 →
Publication: US 2015/0372203
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →