IP Library Assignment 036476/0227
Patent Assignment
Reel/Frame 036476/0227

Assignment of Assignor's Interest

Recorded: 2015-09-02 Pages: 3
Assignor
MOODY, CODY B.
Executed: 2011-06-17
Assignee
RAYTHEON COMPANY
870 WINTER STREET, WALTHAM, MASSACHUSETTS, 02451
Covered Property (1)
Hermetically Sealed Wafer Packages
Patent: 9,287,237 →
Application: 14/640,219 →
Publication: US 2015/0262967