Patent Assignment
Reel/Frame 036489/0573
Assignment of Assignor's Interest
Recorded: 2015-09-03
Pages: 2
Assignor
NAKAJIMA, TSUNEHIRO
Executed: 2015-08-17
Assignee
FUJI ELECTRIC CO., LTD.
1-1 TANABESHINDEN, KAWASAKI-KU,, KAWASAKI-SHI,, 210-9530, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device to Facilitate Peeling of a Supporting Substrate Bonded to a Semiconductor Wafer