Patent Assignment
Reel/Frame 036514/0319
Assignment of Assignor's Interest
Recorded: 2015-09-08
Pages: 5
Assignor
VIA TECHNOLOGIES, INC.
Executed: 2015-07-01
Assignee
VIA ALLIANCE SEMICONDUCTOR CO., LTD
ROOM 301, NO.2537, JINKE ROAD, ZHANGJIANG HI-TECH PARK, SHANGHAI, 201203, CHINA
Covered Properties
(19)
Microprocessor Mechanism for Decompression of Fuse Correction Data
Patent:
8,879,345 →
Application:
13/972,768 →
Microprocessor Mechanism for Decompression of Cache Correction Data
Apparatus and Method for Compression and Decompression of Microprocessor Configuration Data
Correctable Configuration Data Compression and Decompression System
Fingerprint Units Comparing Stored Static Fingerprints with Dynamically Generated Fingerprints and Reconfiguring Processor Settings Upon a Fingerprint Match
Microprocessor with Integrated Nop Slide Detector
Selective Accumulation and Use of Predicting Unit History
Dynamic Cache Enlarging by Counting Evictions
Multi-Core Apparatus and Method for Restoring Data Arrays Following a Power Gating Event
Multi-Core Data Array Power Gating Restoral Mechanism
Multi-Core Microprocessor Power Gating Cache Restoral Mechanism
Apparatus and Method for Repairing Cache Arrays in a Multi-Core Microprocessor
Processor That Leapfrogs Mov Instructions
Dynamic System Configuration Based on Cloud-Collaborative Experimentation
Dynamically Configurable System Based on Cloud-Collaborative Experimentation
Processor That Performs Approximate Computing Instructions
Processor That Recovers from Excessive Approximate Computing Error
Processor with Approximate Computing Functional Unit
Non-Atomic Split-Path Fused Multiply-Accumulate with Rounding Cache
Application:
62/020,246 →
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 21, 2013
From: HENRY, G. GLENN; JAIN, DINESH K.
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031057/0458 →
Assignment of Assignor's Interest
Aug 21, 2013
From: HENRY, G. GLENN; JAIN, DINESH K.
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031057/0109 →
Assignment of Assignor's Interest
Aug 21, 2013
From: HENRY, G. GLENN; JAIN, DINESH K.
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031057/0310 →
Assignment of Assignor's Interest
Aug 21, 2013
From: HENRY, G. GLENN; JAIN, DINESH K.
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031057/0366 →
Assignment of Assignor's Interest
Aug 21, 2013
From: HENRY, G. GLENN; JAIN, DINESH K.
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031057/0381 →
Assignment of Assignor's Interest
Oct 30, 2013
From: PARKS, TERRY
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031508/0255 →
Assignment of Assignor's Interest
Oct 31, 2013
From: HENRY, G. GLENN; HOOKER, RODNEY E.; EDDY, COLIN; PARKS, TERRY
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031523/0467 →
Assignment of Assignor's Interest
Feb 17, 2014
From: HOOKER, RODNEY E.; PARKS, TERRY; GREER, JOHN MICHAEL
To: VIA TECHNOLOGIES, INC.
Reel/Frame 032230/0711 →
Assignment of Assignor's Interest
Feb 25, 2014
From: HENRY, G. GLENN; GASKINS, STEPHAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 032290/0172 →
Assignment of Assignor's Interest
May 22, 2014
From: HENRY, G. GLENN; JAIN, DINESH K.; GASKINS, STEPHAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 032952/0890 →
Assignment of Assignor's Interest
May 22, 2014
From: HENRY, G. GLENN; JAIN, DINESH K.; GASKINS, STEPHAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 032952/0992 →
Assignment of Assignor's Interest
May 22, 2014
From: HENRY, G. GLENN; JAIN, DINESH K.; GASKINS, STEPHAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 032952/0624 →
Assignment of Assignor's Interest
May 22, 2014
From: HENRY, G. GLENN; JAIN, DINESH K.; GASKINS, STEPHAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 032952/0782 →
Assignment of Assignor's Interest
Jun 25, 2014
From: COL, GERARD M.; DAY, MATTHEW DANIEL
To: VIA TECHNOLOGIES, INC.
Reel/Frame 033180/0405 →
Assignment of Assignor's Interest
Sep 2, 2014
From: CHEN, WEN-CHI; HOOKER, RODNEY E.
To: VIA TECHNOLOGIES, INC.
Reel/Frame 033650/0431 →
Assignment of Assignor's Interest
Sep 2, 2014
From: CHEN, WEN-CHI; HOOKER, RODNEY E.
To: VIA TECHNOLOGIES, INC.
Reel/Frame 033649/0997 →
Assignment of Assignor's Interest
Oct 23, 2014
From: HENRY, G. GLENN; PARKS, TERRY; HOOKER, RODNEY E.
To: VIA TECHNOLOGIES, INC.
Reel/Frame 034023/0722 →
Assignment of Assignor's Interest
Oct 23, 2014
From: HENRY, G. GLENN; PARKS, TERRY; HOOKER, RODNEY E.
To: VIA TECHNOLOGIES, INC.
Reel/Frame 034023/0762 →