Patent Assignment
Reel/Frame 036622/0457
Assignment of Assignor's Interest
Recorded: 2015-09-22
Pages: 6
Assignors
PARK, HONG-BAE
Executed: 2015-06-02
KU, JA-HUM
Executed: 2015-06-03
KIM, MYEONG-CHEOL
Executed: 2015-06-03
LEE, JIN-WOOK
Executed: 2015-06-03
HAN, SUNG-KEE
Executed: 2015-07-29
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same