IP Library Assignment 036708/0427
Patent Assignment
Reel/Frame 036708/0427

Assignment of Assignor's Interest

Recorded: 2015-10-01 Pages: 3
Assignors
MUKHOPADHYAY, RAJARSHI
Executed: 2015-08-28
CAROTHERS, DANIEL N.
Executed: 2015-03-28
COOK, BENJAMIN
Executed: 2015-08-28
Assignee
TEXAS INSTRUMENTS INCORPORATED
12500 TI BOULEVARD, MS 3999, DALLAS, TEXAS, 75243
Covered Property (1)
Semiconductor Die Substrate with Integral Heat Sink
Patent: 9,659,844 →
Application: 14/841,081 →
Publication: US 2017/0062316