Patent Assignment
Reel/Frame 036717/0756
Assignment of Assignor's Interest
Recorded: 2015-10-02
Pages: 4
Assignor
IMEC VZW
Executed: 2015-06-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Modular Sensor Platform
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 2, 2015
From: PENDERS, JULIEN; BROWN, LINDSAY
To: STICHTING IMEC NEDERLAND
Reel/Frame 036711/0817 →
Assignment of Assignor's Interest
Oct 2, 2015
From: DESIGN STUDIO NUOVO INC
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 036717/0235 →
Assignment of Assignor's Interest
Oct 2, 2015
From: STICHTING IMEC NEDERLAND
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 036717/0537 →
Assignment of Assignor's Interest
Oct 2, 2015
From: NUOVO, FRANK SETTEMO; PHILLIPS, SHELDON GEORGE
To: DESIGN STUDIO NUOVO INC
Reel/Frame 036711/0579 →
Assignment of Assignor's Interest
Oct 2, 2015
From: TORFS, TOM
To: IMEC VZW
Reel/Frame 036711/0960 →
Assignment of Assignor's Interest
Dec 15, 2015
From: SCHUESSLER, JAMES
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 037296/0870 →
Assignment of Assignor's Interest
Dec 15, 2015
From: FISH, RAM
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 037296/0793 →