Patent Assignment
Reel/Frame 036728/0146
Assignment of Assignor's Interest
Recorded: 2015-10-05
Pages: 6
Assignors
KEN, CHI
Executed: 2015-09-06
OKA, KANJI
Executed: 2015-08-26
IZAWA, TATSUNORI
Executed: 2015-08-26
HORIE, TAKAYUKI
Executed: 2015-08-26
YAMADA, TAKAYUKI
Executed: 2015-08-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Fusing Device Employing Induction Heating Method and Image Forming Apparatus Using the Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 21, 2017
From: SAMSUNG ELECTRONICS CO., LTD
To: S-PRINTING SOLUTION CO., LTD.
Reel/Frame 041852/0125 →
Change of Name
Aug 17, 2018
From: S-PRINTING SOLUTION CO., LTD.
To: HP PRINTING KOREA CO., LTD.
Reel/Frame 047370/0405 →
Corrective Assignment to Correct the Documentation Evidencing the Change of Name Previously Recorded on Reel 047370 Frame 0405. Assignor(S) Hereby Confirms the Change of Name.
Nov 21, 2018
From: S-PRINTING SOLUTION CO., LTD.
To: HP PRINTING KOREA CO., LTD.
Reel/Frame 047769/0001 →
Change of Legal Entity Effective Aug. 31, 2018
Oct 16, 2019
From: HP PRINTING KOREA CO., LTD.
To: HP PRINTING KOREA CO., LTD.
Reel/Frame 050938/0139 →
Confirmatory Assignment Effective November 1, 2018
Oct 17, 2019
From: HP PRINTING KOREA CO., LTD.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 050747/0080 →