Patent Assignment
Reel/Frame 036732/0558
Assignment of Assignor's Interest
Recorded: 2015-10-06
Pages: 6
Assignors
SAKAMOTO, HAJIME
Executed: 2015-09-09
KUNIEDA, MASATOSHI
Executed: 2015-09-09
TERUI, MAKOTO
Executed: 2015-09-09
KARIYA, TAKASHI
Executed: 2015-09-09
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board, Method for Manufacturing the Same and Semiconductor Device