Patent Assignment
Reel/Frame 037025/0082
Assignment of Assignor's Interest
Recorded: 2015-11-12
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6,, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming a Semiconductor Component Comprising a Second Passivation Layer Having a First Opening Exposing a Bond Pad and a Plurality of Second Openings Exposing a Top Surface of an Underlying First Passivation Layer