Patent Assignment
Reel/Frame 037041/0442
Assignment of Assignor's Interest
Recorded: 2015-11-14
Pages: 5
Assignors
WU, YUNG-HSU
Executed: 2015-10-16
CHEN, HAI-CHING
Executed: 2015-10-16
TSAI, JUNG-HSUN
Executed: 2015-10-19
SHUE, SHAU-LIN
Executed: 2015-10-26
BAO, TIEN-I
Executed: 2015-10-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method and Apparatus for Forming Self-Aligned via with Selectively Deposited Etching Stop Layer