Patent Assignment
Reel/Frame 037074/0927
Assignment of Assignor's Interest
Recorded: 2015-11-18
Pages: 3
Assignors
WE, HONG BOK
Executed: 2015-10-30
KIM, DONG WOOK
Executed: 2015-10-30
LEE, JAE SIK
Executed: 2015-10-30
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Semiconductor Package with High Density Die to Die Connection and Method of Making the Same