Patent Assignment
Reel/Frame 037096/0814
Assignment of Assignor's Interest
Recorded: 2015-11-20
Pages: 3
Assignor
TAGUCHI, YASUHIRO
Executed: 2015-11-19
Assignee
SEIKO INSTRUMENTS INC.
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Mold for Resin Sealing a Semiconductor Chip, and Semiconductor Device Having Resin-Sealed Semiconductor Chip
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 10, 2016
From: SEIKO INSTRUMENTS INC.
To: SII SEMICONDUCTOR CORPORATION
Reel/Frame 038058/0892 →
Change of Name
Mar 12, 2018
From: SII SEMICONDUCTOR CORPORATION
To: ABLIC INC.
Reel/Frame 045567/0927 →
Change of Address
Jun 8, 2023
From: ABLIC INC.
To: ABLIC INC.
Reel/Frame 064021/0575 →