Patent Assignment
Reel/Frame 037099/0168
Assignment of Assignor's Interest
Recorded: 2015-11-20
Pages: 3
Assignor
SUH, JUNGWON
Executed: 2009-10-06
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Vertically Stackable Dies Having Chip Identifier Structures