Assignment of Assignor's Interest

Recorded: 2015-11-25 Pages: 3

Assignors

LEE, SANG EUN

Executed: 2015-10-14

KO, EUN

Executed: 2015-10-14

PARK, YONG JAE

Executed: 2015-10-14

Assignee

SK HYNIX INC.

2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Package Embedded with Plurality of Chips and Method of Manufacturing the Same

Patent: 9,711,482 →

Application: 14/951,727 →

Publication: US 2017/0062384

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.