IP Library › Assignment 037170/0595
Patent Assignment
Reel/Frame 037170/0595

Assignment of Assignor's Interest

Recorded: 2015-11-30 Pages: 3
Assignors
KHAN, REZAUR RAHMAN
Executed: 2015-11-19
ZHAO, SAM ZIQUN
Executed: 2015-11-19
Assignee
BROADCOM CORPORATION
5300 CALIFORNIA AVENUE, IRVINE, CALIFORNIA, 92617
Covered Property (1)
Fan-out 3D IC Integration Structure without Substrate and Method of Making the Same
Patent: 9,837,378 →
Application: 14/954,679 →
Publication: US 2017/0117251
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
Merger Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
Corrective Assignment to Correct the Execution Date Previously Recorded at Reel: 047422 Frame: 0464. Assignor(S) Hereby Confirms the Merger. Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →