Patent Assignment
Reel/Frame 037198/0550
Assignment of Assignor's Interest
Recorded: 2015-12-03
Pages: 7
Assignors
BAI, KEUNHEE
Executed: 2015-08-04
KIM, DOHYOUNG
Executed: 2015-08-05
KIM, JOHNSOO
Executed: 2015-08-04
PARK, HEUNGSIK
Executed: 2015-08-04
LEE, DOO-YOUNG
Executed: 2015-08-04
LEE, SANGHYUN
Executed: 2015-08-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Semiconductor Device