Patent Assignment
Reel/Frame 037202/0933
Assignment of Assignor's Interest
Recorded: 2015-12-03
Pages: 2
Assignor
KODAMA, EISUKE
Executed: 2015-11-05
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Including a Fuse Formed on a High Thermal Conductivity Insulating Film
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.