Patent Assignment
Reel/Frame 037203/0575
Assignment of Assignor's Interest
Recorded: 2015-12-03
Pages: 3
Assignor
LI, SHIDONG
Executed: 2015-12-02
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Packaging for High Speed Chip to Chip Communication