Patent Assignment
Reel/Frame 037207/0319
Assignment of Assignor's Interest
Recorded: 2015-12-04
Pages: 3
Assignee
BROADCOM CORPORATION
5300 CALIFORNIA AVENUE, IRVINE, CALIFORNIA, 92617
Covered Property
(1)
Fan-out 3D IC Integration Structure without Substrate and Method of Making the Same
Application:
62/245,900 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
Assignment of Assignor's Interest
Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041708/0001 →
Termination and Release of Security Interest in Patents
Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →