Patent Assignment
Reel/Frame 037223/0080
Assignment of Assignor's Interest
Recorded: 2015-12-07
Pages: 2
Assignors
IKEO, SATOSHI
Executed: 2015-11-17
SAGAWA, TOSHIFUMI
Executed: 2015-11-18
DOI, RYOSUKE
Executed: 2015-11-17
KIKUCHI, HIROSHI
Executed: 2015-11-17
MUKUNO, HIDEKI
Executed: 2015-11-17
Assignee
HITACHI AUTOMOTIVE SYSTEMS, LTD.
2520, TAKABA, HITACHINAKA-SHI, IBARAKI, JAPAN
Covered Property
(1)
Adhesive Sheet, Method for Manufacturing Semiconductor Device Using Same, Method for Manufacturing Thermal Airflow Sensor Using Same, and Thermal Airflow Sensor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.