Patent Assignment
Reel/Frame 037268/0037
Assignment of Assignor's Interest
Recorded: 2015-12-11
Pages: 7
Assignors
CHUNG, JAE-YUP
Executed: 2015-10-03
LEE, YOON-SEOK
Executed: 2015-10-03
KIM, HYUN-JO
Executed: 2015-10-03
RHEE, HWA-SUNG
Executed: 2015-10-03
JEONG, HEE-DON
Executed: 2015-10-02
PARK, SE-WAN
Executed: 2015-10-03
JEONG, BO-CHEOL
Executed: 2015-10-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices and Methods of Manufacturing the Same