IP Library › Assignment 037293/0861
Patent Assignment
Reel/Frame 037293/0861

Release of Security Interest

Recorded: 2015-12-15 Pages: 4
Assignor
Assignee
ECOVISION TECHNOLOGIES, LLC
6161 VENTNOR AVE., DAYTON, OHIO, 45414
Covered Properties (3)
Apparatus and Methods for Modular Preform Mold System
Patent: 7,854,876 →
Application: 11/829,326 →
Publication: US 2008/0290561
Systems and Methods for Mobile and/or Modular Manufacturing
Patent: 8,543,434 →
Application: 12/127,402 →
Publication: US 2012/0274000
Apparatus and Methods for Modular Preform Mold System
Patent: 8,613,613 →
Application: 12/948,093 →
Publication: US 2011/0062629
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement Mar 20, 2015
From: ECOVISION TECHNOLOGIES, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 035834/0423 →
Assignment of Assignor's Interest Dec 4, 2015
From: ECOVISION TECHNOLOGIES, LLC
To: AMCOR RIGID PLASTICS USA, LLC
Reel/Frame 037207/0258 →
Assignment of Assignor's Interest Aug 18, 2017
From: AMCOR LIMITED
To: AMCOR GROUP GMBH
Reel/Frame 043595/0444 →
Assignment of Assignor's Interest Oct 11, 2018
From: AMCOR GROUP GMBH
To: AMCOR RIGID PLASTICS USA, LLC
Reel/Frame 047215/0173 →