Patent Assignment
Reel/Frame 037331/0225
Assignment of Assignor's Interest
Recorded: 2015-12-18
Pages: 4
Assignors
ENDOH, KEIICHI
Executed: 2015-11-16
NAGAOKA, MINAMI
Executed: 2015-11-09
KURITA, SATORU
Executed: 2015-11-10
MIYOSHI, HIROMASA
Executed: 2015-11-09
KOHNO, YOSHIKO
Executed: 2015-11-09
MIYAZAWA, AKIHIRO
Executed: 2015-11-09
Assignee
DOWA ELECTRONICS MATERIALS CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8617, JAPAN
Covered Property
(1)
Bonding Material and Bonding Method Using Same